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ASTM D4300-01(2008)

Standard Test Methods for Ability of Adhesive Films to Support or Resist the Growth of Fungi

STANDARD published on 1.4.2008

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The information about the standard:

Designation standards: ASTM D4300-01(2008)
Note: WITHDRAWN
Publication date standards: 1.4.2008
The number of pages: 9
Approximate weight : 27 g (0.06 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM D4300-01(2008) :

Keywords:
adhesive film, biodegradation, biological testing, fungi, Contamination--adhesives, Fungal influence/resistance--adhesives, Biodegradation, Biological data analysis, Dry adhesives, Microbiological examination, Mineral salts agar (MSA), Nuclear reactor vessels, Potato dextrose agar (PDA), Spore concentration (in inoculum), ICS Number Code 83.180 (Adhesives)