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ASTM D5109-99

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

STANDARD published on 10.10.1999

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The information about the standard:

Designation standards: ASTM D5109-99
Note: WITHDRAWN
Publication date standards: 10.10.1999
The number of pages: 8
Approximate weight : 24 g (0.05 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM D5109-99 :

Keywords:
Copper-clad materials Electrical properties Fiber reinforced polymers Industrial laminate Laminates-electrical insulation Polymers-electrical insulation applications Printed circuits Rigid laminate Thermosetting materials/properties Wiring boards copper-clad laminates-testing, from fiber-reinforced thermosetting polymers for printed wiring boards, Crosswise dimensional instability Dimensional instability Instability Lengthwise d