Standard Specification for Polymeric Resin Film for Electrical Insulation and Dielectric Applications

The information about the standard:

Designation standards: ASTM D5213-04
Note: WITHDRAWN
Publication date standards: 1.5.2004
The number of pages: 6
Approximate weight : 18 g (0.04 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM D5213-04 :

Keywords:
conditioning, dielectric strength, dissipation factor, elongation, FEP fluorocarbon, film, fluorinated poly(ethylene-propylene), heat-seal strength, heatsealable, permittivity, polyethylene naphthalate, polyethylene terephthalate, polyimide, poly(N, N`-p, p`-oxydiphenylene biphenyltetracarboxylimide), poly(N, N`-p, p`oxydiphenylene pyromellitimide), poly(N, N`-p-phenylene biphenyltetra-carboxylimide), shrinkage, tensile strength, thickness, volume resistivity