Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration

The information about the standard:

Designation standards: ASTM F1259-89
Note: WITHDRAWN
Publication date standards: 1.1.1989
The number of pages: 2
Approximate weight : 6 g (0.01 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F1259-89 :

Keywords:
Accelerated aging/testing-semiconductors, Defects-semiconductors, Electrical conductors-semiconductors, Electromigration, Failure end point-electronic components/devices, Metallization, Microelectronic device processing, Resistance-failure, Silicon-semiconductor applications, Straight-line testing, Test structures, Time to failure, Voltage, design of flat straight-line test structures (for detecting, metallization open-circuit/resistance to increase failure due to, electromigration), guide