Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric]
STANDARD published on 1.1.1996
Designation standards: ASTM F1259M-96
Note: WITHDRAWN
Publication date standards: 1.1.1996
The number of pages: 2
Approximate weight : 6 g (0.01 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
design guideline, electromigration, electromigration failure, interconnect metallization, metallization open circuit, metallization resistance, microelectronic, test structure, ICS Number Code 17.220.20 (Measurement of electrical and magnetic quantities), 31.200 (Integrated circuits. Microelectronics)