ASTM F1259M-96(2003)

Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric] (Withdrawn 2009)

STANDARD published on 10.6.1996

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The information about the standard:

Designation standards: ASTM F1259M-96(2003)
Note: WITHDRAWN
Publication date standards: 10.6.1996
The number of pages: 2
Approximate weight : 6 g (0.01 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F1259M-96(2003) :

Keywords:
design guideline, electromigration, electromigration failure, interconnect metallization, metallization open-circuit, metallization resistance, microelectronic, test structure