
Standard Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations [Metric]
STANDARD published on 1.1.1996
Designation standards: ASTM F1260M-96
Note: WITHDRAWN
Publication date standards: 1.1.1996
The number of pages: 8
Approximate weight : 24 g (0.05 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
electromigration, electromigration metallization, integrated circuit, microelectronics, open circuit, resistance increase, time-to-failure, ICS Number Code 17.220.20 (Measurement of electrical and magnetic quantities), 31.200 (Integrated circuits. Microelectronics)