ASTM F1390-97

Standard Test Method for Measuring Warp on Silicon Wafers by Automated Noncontact Scanning

STANDARD published on 10.6.1997

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The information about the standard:

Designation standards: ASTM F1390-97
Note: WITHDRAWN
Publication date standards: 10.6.1997
The number of pages: 9
Approximate weight : 27 g (0.06 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F1390-97 :

Keywords:
noncontact measurement, semiconductor, shape, silicon, wafers, warp, ICS Number Code 29.045 (Semiconducting materials)