ASTM F357-78(1997)e1

Standard Practice for Determining Solderability of Thick Film Conductors (Includes all amendments And changes 3/2/2021).

STANDARD published on 1.1.1991

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The information about the standard:

Designation standards: ASTM F357-78(1997)e1
Note: WITHDRAWN
Publication date standards: 1.1.1991
The number of pages: 2
Approximate weight : 6 g (0.01 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F357-78(1997)e1 :

Keywords:
hybrid microcircuits, solderability, solder wetting, thick-film metallization