
Standard Practice for Determining Solderability of Thick Film Conductors (Withdrawn 2008)
STANDARD published on 10.12.2002
Designation standards: ASTM F357-78(2002)
Note: WITHDRAWN
Publication date standards: 10.12.2002
The number of pages: 2
Approximate weight : 6 g (0.01 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
hybrid microcircuits, solderability, solder wetting, thick-film metallization, ICS Number Code 29.050 (Superconductivity and conducting materials)