ASTM F459-06

Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds

STANDARD published on 1.1.2006

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The information about the standard:

Designation standards: ASTM F459-06
Note: WITHDRAWN
Publication date standards: 1.1.2006
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F459-06 :

Keywords:
pull strength of microelectronic wire bonds, aluminum ultra-sonic wedge bonds, aluminum ball bonds, gold wedge bonds, ball bonds, wire bonds, ICS Number Code 29.120.20 (Connecting devices)