ASTM F459-84(1995)e1

Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Includes all amendments And changes 8/16/2017).

STANDARD published on 1.1.2001

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The information about the standard:

Designation standards: ASTM F459-84(1995)e1
Note: WITHDRAWN
Publication date standards: 1.1.2001
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F459-84(1995)e1 :

Keywords:
pull strength of microelectronic wire bonds, aluminum ultra-sonic wedge bonds, aluminum ball bonds, gold wedge bonds, ball bonds, wire bonds