Standard Practice for Specifying Thick-Film Pastes (Includes all amendments And changes 3/2/2021).
STANDARD published on 1.1.1991
Designation standards: ASTM F508-77(1997)e1
Note: WITHDRAWN
Publication date standards: 1.1.1991
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
hybrid microcircuits, reliability, solderability, thick films