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ASTM F508-77(1997)e1

Standard Practice for Specifying Thick-Film Pastes (Includes all amendments And changes 3/2/2021).

STANDARD published on 1.1.1991

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The information about the standard:

Designation standards: ASTM F508-77(1997)e1
Note: WITHDRAWN
Publication date standards: 1.1.1991
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F508-77(1997)e1 :

Keywords:
hybrid microcircuits, reliability, solderability, thick films