ASTM F542-07

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)

STANDARD published on 1.5.2007

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The information about the standard:

Designation standards: ASTM F542-07
Note: WITHDRAWN
Publication date standards: 1.5.2007
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F542-07 :

Keywords:
electronic, encapsulating compounds, exothermic temperature, microelectronic encapsulation, ICS Number Code 31.240 (Mechanical structures for electronic equipment)