Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
STANDARD published on 10.10.1998
Designation standards: ASTM F542-98
Note: WITHDRAWN
Publication date standards: 10.10.1998
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
electronic, encapsulating compounds, exothermic temperature, microelectronic encapsulation, ICS Number Code 31.240 (Mechanical structures for electronic equipment)