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ASTM F584-87(2005)

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

STANDARD published on 1.5.2005

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The information about the standard:

Designation standards: ASTM F584-87(2005)
Note: WITHDRAWN
Publication date standards: 1.5.2005
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F584-87(2005) :

Keywords:
bonding wire, inspection, lead-bonding wire, semiconductor packaging, visual inspection, wire, ICS Number Code 29.060.10 (Wires)