Guide for Selection of Tests for Material Properties of Liquid Thermoset Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)
Designation standards: ASTM F635-85(1991)
Note: WITHDRAWN
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM