ASTM F657-92(1999)

Standard Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning (Withdrawn 2003)

STANDARD published on 1.1.1999

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The information about the standard:

Designation standards: ASTM F657-92(1999)
Note: WITHDRAWN
Publication date standards: 1.1.1999
The number of pages: 10
Approximate weight : 30 g (0.07 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F657-92(1999) :

Keywords:
Nondestructive evaluation (NDE)-semiconductors, Thickness-semiconductors, Total thickness, TTV (total thickness variation), Warp-semiconductors, warp/total thickness variation-silicon wafers, by noncontact scanning,, test,, Silicon-semiconductor applications, wafers-warp/total thickness variation (TTV), by noncontact scanning,, test, ICS Number Code 29.045 (Semiconducting materials)