ASTM F677-04

Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications

STANDARD published on 1.3.2004

English -
PDF - Immediate download (73.00 USD)

English -

Print design (73.00 USD)

The information about the standard:

Designation standards: ASTM F677-04
Note: WITHDRAWN
Publication date standards: 1.3.2004
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F677-04 :

Keywords:
electronic, encapsulating compound, grease, microelectronics