ASTM F677-04(2009)

Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications

STANDARD published on 1.10.2009

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The information about the standard:

Designation standards: ASTM F677-04(2009)
Note: WITHDRAWN
Publication date standards: 1.10.2009
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F677-04(2009) :

Keywords:
electronic, encapsulating compound, grease, microelectronics, Electronic encapsulants, Electronic materials/applications, Fluid resistance, Grease resistance, Microelectronic devices, ICS Number Code 31.020 (Electronic components in general)