Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates
STANDARD published on 1.1.1991
Designation standards: ASTM F692-97
Note: WITHDRAWN
Publication date standards: 1.1.1991
The number of pages: 6
Approximate weight : 18 g (0.04 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
adhesion strength, metallization, solderable thick film