
Standard Specification for Gold Wire for Semiconductor Lead Bonding
STANDARD published on 1.4.2024
Designation standards: ASTM F72-24
Publication date standards: 1.4.2024
The number of pages: 11
Approximate weight : 33 g (0.07 lbs)
Country: American technical standard
Category: Technical standards ASTM
This specification covers round drawn/extruded gold wires for internal semiconductor device electrical connections. The wires are available in four classifications, namely: copper-modified wire, beryllium-modified wire, high-strength wire, and special purpose wire. Aptly sampled wires shall be examined by test methods suggested herein, and each class shall conform correspondingly to specified requirements for chemical composition, mechanical properties (breaking load and elongation), dimension (diameter and weight), and workmanship and finish. The wires shall also undergo wire curl, wire axial twist, and wire roundness tests.