Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications (Withdrawn 2020)

The information about the standard:

Designation standards: ASTM F1238-95(2011)
Note: WITHDRAWN
Publication date standards: 1.6.2011
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F1238-95(2011) :

Keywords:
density, microelectronics, molybdenum disilicide, refractory silicides, sputtering, sputtering targets, tantalum disilicide, titanium disilicide, tungsten disilicide, Electrical conductors (semiconductors)--specifications, Electronic materials/applications--specifications, Metallic silicide, Molybdenum (electronic applications)--specifications, Polycaprolactone (PCL), Refractory silicide targets, Silicides, Tantalum (Ta)/tantalum alloys--specifications, Targets, Titanium silicide