ASTM F1512-94(2011)

Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)

STANDARD published on 1.6.2011

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The information about the standard:

Designation standards: ASTM F1512-94(2011)
Note: WITHDRAWN
Publication date standards: 1.6.2011
The number of pages: 5
Approximate weight : 15 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F1512-94(2011) :

Keywords:
backing plates, bonding, nondestructive testing, sputtering, targets, thin films, ultrasonic testing, Backing plates, Bonding--electronic materials, Electronic thin-film applications, Nondestructive evaluation (NDE)--electronic applications, Sputtering process/targets, Targets, Thin film applications, Ultrasonic testing, ICS Number Code 19.100 (Non-destructive testing)