ASTM F1530-94

Standard Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning

STANDARD published on 1.1.1994

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The information about the standard:

Designation standards: ASTM F1530-94
Note: WITHDRAWN
Publication date standards: 1.1.1994
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F1530-94 :

Keywords:
Flatness-semiconductors, Noncontact technique, Nondestructive evaluation (NDE)-semiconductors, Probe methods, Silicon semiconductors-slices/wafers, Silicon semiconductors-slices/wafers, Thickness-semiconductors, Thickness variation, Wafers, silicon wafers-flatness/thickness/thickness variation, by automated, noncontact scanning, test, ICS Number Code 29.045 (Semiconducting materials)