ASTM F3147-15

Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend (Withdrawn 2024)

STANDARD published on 1.6.2015

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electronic design (pdf) (66.00 USD)

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Print design (66.00 USD)

The information about the standard:

Designation standards: ASTM F3147-15
Note: WITHDRAWN
Publication date standards: 1.6.2015
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F3147-15 :

Keywords:
bend, conductive adhesive, encapsulant, land-pad, mandrel, printed flexible circuit, SMD, staking compound,, ICS Number Code 31.020 (Electronic components in general)