Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)
STANDARD published on 1.3.2018
Designation standards: ASTM F459-13(2018)
Note: WITHDRAWN
Publication date standards: 1.3.2018
The number of pages: 5
Approximate weight : 15 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
microelectronic wire bonds, pull strength, wire bonds,, ICS Number Code 29.120.20 (Connecting devices)