ASTM F638-88(1995)e1

Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Includes all amendments And changes 3/2/2021).

STANDARD published on 1.1.2001

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The information about the standard:

Designation standards: ASTM F638-88(1995)e1
Note: WITHDRAWN
Publication date standards: 1.1.2001
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F638-88(1995)e1 :

Keywords:
magnesium aluminum wire, wire bonding