
Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits.
STANDARD published on 15.9.1997
Designation standards: BS 3934-5:1997
Publication date standards: 15.9.1997
The number of pages: 38
Approximate weight : 114 g (0.25 lbs)
Country: British technical standard
Category: Technical standards BS
Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB). Status: Definitive