BS 5909:1980

Method for scale adhesion test for oxygen-free copper.

STANDARD published on 30.4.1980

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The information about the standard:

Designation standards: BS 5909:1980
Publication date standards: 30.4.1980
The number of pages: 6
Approximate weight : 18 g (0.04 lbs)
Country: British technical standard
Category: Technical standards BS

Annotation of standard text BS 5909:1980 :

Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide. Status: Under Review