
Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage.
STANDARD published on 30.6.2010
Designation standards: BS EN 60191-6-19:2010
Publication date standards: 30.6.2010
The number of pages: 18
Approximate weight : 54 g (0.12 lbs)
Country: British technical standard
Category: Technical standards BS
ISBN: 978 0 580 60758 5 Status: Definitive