
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP).
STANDARD published on 31.12.2010
Designation standards: BS EN 60191-6-21:2010
Publication date standards: 31.12.2010
The number of pages: 18
Approximate weight : 54 g (0.12 lbs)
Country: British technical standard
Category: Technical standards BS
ISBN: 978 0 580 64567 9 Status: Under Review