
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP).
STANDARD published on 15.5.2001
Designation standards: BS EN 60191-6-3:2001
Publication date standards: 15.5.2001
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: British technical standard
Category: Technical standards BS
ISBN: 0 580 37243 X Status: Definitive