BS EN 60191-6-4:2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of ball grid array (BGA).

STANDARD published on 4.8.2003

The information about the standard:

Designation standards: BS EN 60191-6-4:2003
Publication date standards: 4.8.2003
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: British technical standard
Category: Technical standards BS