Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices.
STANDARD published on 19.6.2003
Designation standards: BS EN 60749-15:2003
Note: WITHDRAWN
Publication date standards: 19.6.2003
The number of pages: 10
Approximate weight : 30 g (0.07 lbs)
Country: British technical standard
Category: Technical standards BS