BS EN 61190-1-2:2002

Attachment materials for electronic assembly. Requirements for solder pastes for high-quality interconnections in electronic assembly.

STANDARD published on 12.8.2002

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The information about the standard:

Designation standards: BS EN 61190-1-2:2002
Note: WITHDRAWN
Publication date standards: 12.8.2002
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: British technical standard
Category: Technical standards BS