BS EN 61190-1-2:2007

Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly.

STANDARD published on 31.7.2007

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The information about the standard:

Designation standards: BS EN 61190-1-2:2007
Note: WITHDRAWN
Publication date standards: 31.7.2007
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: British technical standard
Category: Technical standards BS