BS EN 62137-4:2014

Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices.

STANDARD published on 30.6.2015

The information about the standard:

Designation standards: BS EN 62137-4:2014
Publication date standards: 30.6.2015
The number of pages: 48
Approximate weight : 144 g (0.32 lbs)
Country: British technical standard
Category: Technical standards BS