BS EN IEC 60749-22-1:2026

Semiconductor devices — Mechanical and climatic test methods. Bond strength — wire bond pull test methods.

STANDARD published on 21.1.2026

The information about the standard:

Designation standards: BS EN IEC 60749-22-1:2026
Publication date standards: 21.1.2026
The number of pages: 68
Approximate weight : 204 g (0.45 lbs)
Country: British technical standard
Category: Technical standards BS