BS EN IEC 60749-22-2:2026

Semiconductor devices — Mechanical and climatic test methods. Bond strength — Wire bond shear test methods.

STANDARD published on 21.1.2026

The information about the standard:

Designation standards: BS EN IEC 60749-22-2:2026
Publication date standards: 21.1.2026
The number of pages: 40
Approximate weight : 120 g (0.26 lbs)
Country: British technical standard
Category: Technical standards BS