BS EN IEC 61189-5-601:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards.

STANDARD published on 19.3.2021

The information about the standard:

Designation standards: BS EN IEC 61189-5-601:2021
Publication date standards: 19.3.2021
The number of pages: 46
Approximate weight : 138 g (0.30 lbs)
Country: British technical standard
Category: Technical standards BS