BS EN IEC 61190-1-3:2018

Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications.

STANDARD published on 28.3.2018

The information about the standard:

Designation standards: BS EN IEC 61190-1-3:2018
Publication date standards: 28.3.2018
The number of pages: 50
Approximate weight : 150 g (0.33 lbs)
Country: British technical standard
Category: Technical standards BS