
Device embedding assembly technology. Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity.
STANDARD published on 20.8.2021
Designation standards: BS EN IEC 62878-2-602:2021
Publication date standards: 20.8.2021
The number of pages: 18
Approximate weight : 54 g (0.12 lbs)
Country: British technical standard
Category: Technical standards BS
ISBN: 978 0 539 04645 8 Status: Definitive