BS EN IEC 63378-3:2025

Thermal standardization on semiconductor packages. Thermal circuit simulation models of discrete semiconductor packages for transient analysis.

STANDARD published on 24.6.2025

The information about the standard:

Designation standards: BS EN IEC 63378-3:2025
Publication date standards: 24.6.2025
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: British technical standard
Category: Technical standards BS