BS EN IEC 63378-6:2026

Thermal standardization on semiconductor packages. Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points.

STANDARD published on 24.3.2026

The information about the standard:

Designation standards: BS EN IEC 63378-6:2026
Publication date standards: 24.3.2026
The number of pages: 34
Approximate weight : 102 g (0.22 lbs)
Country: British technical standard
Category: Technical standards BS