BS IEC 62047-27:2017

Semiconductor devices. Micro-electromechanical devices. Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT).

STANDARD published on 22.7.2020

The information about the standard:

Designation standards: BS IEC 62047-27:2017
Publication date standards: 22.7.2020
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: British technical standard
Category: Technical standards BS