BS IEC 62047-31:2019

Semiconductor devices. Micro-electromechanical devices. Four-point bending test method for interfacial adhesion energy of layered MEMS materials.

STANDARD published on 17.4.2019

English -
PDF - Immediate download (214.40 USD)

English -

Print design (214.40 USD)

The information about the standard:

Designation standards: BS IEC 62047-31:2019
Publication date standards: 17.4.2019
The number of pages: 16
Approximate weight : 48 g (0.11 lbs)
Country: British technical standard
Category: Technical standards BS

Annotation of standard text BS IEC 62047-31:2019 :

ISBN: 978 0 580 96660 6 Status: Definitive