BS IEC 63011-2:2018

Integrated circuits. Three dimensional integrated circuits. Alignment of stacked dies having fine pitch interconnect.

STANDARD published on 24.1.2019

The information about the standard:

Designation standards: BS IEC 63011-2:2018
Publication date standards: 24.1.2019
The number of pages: 18
Approximate weight : 54 g (0.12 lbs)
Country: British technical standard
Category: Technical standards BS