BS IEC 63378-2-1:2024

Thermal standardization on semiconductor packages. 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages.

STANDARD published on 29.10.2024

The information about the standard:

Designation standards: BS IEC 63378-2-1:2024
Publication date standards: 29.10.2024
The number of pages: 18
Approximate weight : 54 g (0.12 lbs)
Country: British technical standard
Category: Technical standards BS