
Device embedded substrate - Part 1-1: Generic specification - Test methods
STANDARD published on 1.12.2015
    
        Designation standards: ČSN EN 62878-1-1
                Classification mark:  359378
                
                Catalog number:  98352
                
                
               
                Publication date standards:  1.12.2015
        The number of pages: 64
Approximate weight : 192 g (0.42 lbs)
        Country:          Czech technical standard
        Category: Technical standards ČSN
        
                
              
This part of IEC 62878 specifies the test methods of passive and active device embedded sub-strates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3.
  This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
  The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421